Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1023S-100+
|
Dallas Semiconductor | 完全替代 | SOIC |
MAXIM INTEGRATED PRODUCTS DS1023S-100+ 芯片, 延迟线
|
||
DS1023S-200+
|
Maxim Integrated | 完全替代 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS DS1023S-200+ 芯片, 延迟线
|
||
DS1023S-50+
|
Maxim Integrated | 功能相似 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS DS1023S-50+ 芯片, 延迟线
|
||
DS1023S-500+
|
Dallas Semiconductor | 完全替代 | SOP |
MAXIM INTEGRATED PRODUCTS DS1023S-500+ 芯片, 延迟线
|
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