Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: HLSOP
External dimensions/packaging: HLSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LP3882EMR-1.5/NOPB
|
TI | 功能相似 | SOIC-8 |
1.5A、超低压降稳压器 8-SO PowerPAD -40 to 125
|
||
LP3882EMR-1.5/NOPB
|
National Semiconductor | 功能相似 | SOIC-8 |
1.5A、超低压降稳压器 8-SO PowerPAD -40 to 125
|
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