Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
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National Semiconductor | 功能相似 | SOP |
2.9内华达州/开方(赫兹)低噪声,高精度, RRIO放大器 2.9 nV/sqrt(Hz) Low Noise, Precision, RRIO Amplifier
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TI | 功能相似 | SOP |
2.9内华达州/开方(赫兹)低噪声,高精度, RRIO放大器 2.9 nV/sqrt(Hz) Low Noise, Precision, RRIO Amplifier
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