Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MicroSMD-4
External dimensions/packaging: MicroSMD-4
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMV1012XP-15
|
National Semiconductor | 类似代替 | VFBGA |
音频功率放大器 LMV1012XP-15 DSBGA-4
|
||
LMV1012XPX-15/NOPB
|
TI | 类似代替 | UFBGA-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin Micro SMD T/R
|
||
LMV1012XPX-15/NOPB
|
National Semiconductor | 类似代替 | MicroSMD-4 |
Audio Amp Microphone 1CH Mono Class-AB 4Pin Micro SMD T/R
|
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