Encapsulation parameters/Encapsulation: LSOP
External dimensions/packaging: LSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMH6672MAX/NOPB
|
TI | 功能相似 | SOIC-8 |
运算放大器 - 运放 Dual, High Output Current, High Speed Op Amp 8-SOIC -40 to 85
|
||
LMH6672MRX
|
TI | 功能相似 | HSOP |
运算放大器 - 运放
|
||
LMH6672MRX/NOPB
|
TI | 功能相似 | HSOP-8 |
运算放大器 - 运放 Dual, High Output Current, High Speed Op Amp 8-SO PowerPAD -40 to 85
|
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