Technical parameters/power supply voltage (DC): 3.30 V
Technical parameters/power consumption: 149 W
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.9 mm
External dimensions/packaging: SOIC-8
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMH0002MAX/NOPB
|
National Semiconductor | 完全替代 | SOIC-8 |
SMPTE 292M/259M 串行数字电缆驱动器 8-SOIC -40 to 85
|
||
LMH0002TMA/NOPB
|
TI | 完全替代 | SOIC-8 |
线路驱动器芯片, 串行数字线缆, 1.485 Gbps数据率, 单路3.3 V电源, SOIC-8
|
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