Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMC8101MM/NOPB
|
TI | 完全替代 | VSSOP-8 |
运算放大器 LMC8101MM/NOPB VSSOP-8
|
||
LMC8101MMX
|
TI | 功能相似 | MSOP-8 |
Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown 8-VSSOP -40℃ to 85℃
|
||
LMC8101MMX/NOPB
|
TI | 完全替代 | VSSOP-8 |
运算放大器 LMC8101MMX/NOPB VSSOP-8
|
||
LMC8101MMX/NOPB
|
National Semiconductor | 完全替代 | MSOP-8 |
运算放大器 LMC8101MMX/NOPB VSSOP-8
|
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