Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LMC6042AIN
|
National Semiconductor | 功能相似 | DIP |
LMC6042 CMOS双路微功耗运算放大器 LMC6042 CMOS Dual Micropower Operational Amplifier
|
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