Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BGA-9
External dimensions/packaging: BGA-9
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TPA6111A2DR
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS TPA6111A2DR 芯片, 音频功率放大器, AB级, 150MW, SOIC-8, 整卷
|
||
TPA701DGN
|
TI | 类似代替 | PowerPad-MSOP-8 |
TEXAS INSTRUMENTS TPA701DGN. 音频功率放大器, AB, 1通道, 700 mW, 2.5V 至 5.5V, MSOP, 8 引脚
|
||
TPA701DGN
|
Rochester | 类似代替 |
TEXAS INSTRUMENTS TPA701DGN. 音频功率放大器, AB, 1通道, 700 mW, 2.5V 至 5.5V, MSOP, 8 引脚
|
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