Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | VFBGA |
Audio Amp Speaker 1CH Mono 1W Class-AB 9Pin uSMD T/R
|
||
|
|
National Semiconductor | 功能相似 | MicroSMD-9 |
Amplifier IC 1Channel (Mono) Class AB 1W x 1 @ 8Ω 9-uSMD
|
||
LM4890ITLX/NOPB
|
TI | 功能相似 | WFBGA-9 |
Audio Amp Speaker 1CH Mono 1W Class-AB 9Pin uSMD T/R
|
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