Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | VFBGA |
IC AMP AUDIO PWR 1.15W AB 25BGA
|
||
LM4845ITLX/NOPB
|
TI | 功能相似 | WFBGA-25 |
Audio Amp Headphone/Speaker 1CH Mono/2CH Stereo 1.15W Class-AB 25Pin uSMD T/R
|
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