Technical parameters/output voltage (Max): 1.235 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Rail
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM385BD-1-2
|
TI | 类似代替 | SOIC-8 |
TEXAS INSTRUMENTS LM385BD-1-2 电压基准, 微功率, 分流 - 固定, LM385B系列, 1.235V, SOIC-8
|
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