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Model LM358N
Description LM158 / LM258 / LM358 / LM2904Low Power Dual Operational Amplifiers LM158/LM258/LM358/LM2904
Product QR code
Brand: TI
Packaging DIP-8
Delivery time
Packaging method Each
Standard packaging quantity 1
2.73  yuan 2.73yuan
5+:
$ 3.6842
25+:
$ 3.4113
50+:
$ 3.2202
100+:
$ 3.1384
500+:
$ 3.0838
2500+:
$ 3.0155
5000+:
$ 2.9883
10000+:
$ 2.9473
Quantity
5+
25+
50+
100+
500+
Price
$3.6842
$3.4113
$3.2202
$3.1384
$3.0838
Price $ 3.6842 $ 3.4113 $ 3.2202 $ 3.1384 $ 3.0838
Start batch production 5+ 25+ 50+ 100+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4752) Minimum order quantity(5)
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Technical parameters/power supply voltage (DC): 5.00 V

Technical parameters/output current: 20.0 mA

Technical parameters/power supply current: 1 mA

Technical parameters/number of circuits: 2

Technical parameters/number of channels: 2

Technical parameters/common mode rejection ratio: 65 dB

Technical parameters/Input compensation drift: 7.00 µV/K

Technical parameters/bandwidth: 1 MHz

Technical parameters/conversion rate: 100 mV/μs

Technical parameters/gain bandwidth product: 1 MHz

Technical parameters/input compensation voltage: 2 mV

Technical parameters/input bias current: 45 nA

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/gain bandwidth: 1 MHz

Technical parameters/power supply voltage: 3V ~ 32V

Technical parameters/power supply voltage (Max): 32 V

Technical parameters/power supply voltage (Min): 3 V

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 8

Encapsulation parameters/Encapsulation: DIP-8

External dimensions/width: 6.35 mm

External dimensions/packaging: DIP-8

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Each

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Contains Lead

Compliant with standard/REACH SVHC version: 2015/06/15

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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