Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC-24
External dimensions/packaging: SOIC-24
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM2575-3.3BWM-TR
|
Microchip | 完全替代 | SOIC-24 |
Conv DC-DC 4V to 40V Step Down Single-Out 3.3V 1A 24Pin SOIC W T/R
|
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