Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 676
Encapsulation parameters/Encapsulation: FBGA-676
External dimensions/packaging: FBGA-676
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX500-2FGG676
|
Microchip | 完全替代 | FBGA |
FPGA Axcelerator Family 286K Gates 5376 Cells 870MHz 0.15um Technology 1.5V 676Pin FBGA
|
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