Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 896
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
AX2000-1FGG896
|
Microsemi | 类似代替 | FBGA-896 |
Field Programmable Gate Array, 21504 CLBs, 2000000Gates, 763MHz, 32256-Cell, CMOS, PBGA896, 1MM PITCH, ROHS COMPLIANT, FBGA-896
|
||
AX2000-1FGG896
|
SOC | 类似代替 | BGA-896 |
Field Programmable Gate Array, 21504 CLBs, 2000000Gates, 763MHz, 32256-Cell, CMOS, PBGA896, 1MM PITCH, ROHS COMPLIANT, FBGA-896
|
||
AX2000-2FGG896
|
Microchip | 类似代替 | FBGA |
Field Programmable Gate Array, 21504 CLBs, 2000000Gates, 870MHz, 32256-Cell, CMOS, PBGA896, 1MM PITCH, ROHS COMPLIANT, FBGA-896
|
||
AX2000-2FGG896I
|
SOC | 类似代替 | BGA-896 |
Field Programmable Gate Array, 21504 CLBs, 2000000Gates, 870MHz, 32256-Cell, CMOS, PBGA896, 1MM PITCH, ROHS COMPLIANT, FBGA-896
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review