Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: BGA-100
External dimensions/packaging: BGA-100
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ATXMEGA64A1-CU
|
Microchip | 功能相似 | TFBGA-100 |
MCU 8Bit/16Bit XMEGA AVR RISC 64KB Flash 1.8V/2.5V/3.3V 100Pin CBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review