Technical parameters/RAM size: 113664 b
Technical parameters/number of logic gates: 8
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 2.3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: BGA-256
External dimensions/height: 1.2 mm
External dimensions/packaging: BGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray, Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFX200EB-03F256C
|
Lattice Semiconductor | 完全替代 | FPBGA-256 |
FPGA ispXPGA Family 210K Gates 2704 Cells 2.5V/3.3V Automotive 256Pin FBGA
|
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