Technical parameters/RAM size: 4526080 b
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 672
Encapsulation parameters/Encapsulation: FPBGA-672
External dimensions/packaging: FPBGA-672
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991.d
Customs Information/Hong Kong Import and Export License: NLR
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFE3-70EA-9FN672C
|
Lattice Semiconductor | 完全替代 | BBGA-672 |
FPGA LatticeECP3 Family 67000 Cells 65nm Technology 1.2V 672Pin FBGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review