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Description HiperLCS The Power Integrations HiperLCS series of integrated AC-DC converters utilizes a resonant half bridge LLC topology to implement efficient offline converters in a compact SIP package. These devices include multifunctional controllers, high side and low side gate drivers, as well as two power MOSFETs in a half bridge configuration, suitable for power supply designs up to 400 W. High integration level can minimize the number of external components and reduce the layout area of printed circuit boards, simplifying power supply design. The maximum operating frequency is 1 MHz and the nominal steady-state operation can reach up to 500 kHz. Programmable browning/power down threshold and hysteresis undervoltage and overvoltage protection, programmable overcurrent protection, short circuit protection, over temperature protection, programmable soft start time and delay before soft start, simple single clip connection of heat sink, AC-DC converter, Power Integrations
Product QR code
Packaging eSIP-16K
Delivery time
Packaging method Tube
Standard packaging quantity 1
32.31  yuan 32.31yuan
1+:
$ 39.4158
10+:
$ 37.1542
100+:
$ 35.4742
250+:
$ 35.2157
500+:
$ 34.9573
1000+:
$ 34.6665
2500+:
$ 34.4080
5000+:
$ 34.2465
Quantity
1+
10+
100+
250+
500+
Price
$39.4158
$37.1542
$35.4742
$35.2157
$34.9573
Price $ 39.4158 $ 37.1542 $ 35.4742 $ 35.2157 $ 34.9573
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(7923) Minimum order quantity(1)
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Technical parameters/number of output interfaces: 1

Technical parameters/input voltage (Max): 15 V

Technical parameters/input voltage (Min): 11.4 V

Technical parameters/output voltage (Max): 530 V

Technical parameters/output current (Max): 10.3 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -40 ℃

Technical parameters/power supply voltage: 11.4V ~ 15V

Technical parameters/input voltage: 11.4V ~ 15V

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 13

Encapsulation parameters/Encapsulation: eSIP-16K

External dimensions/length: 16.59 mm

External dimensions/width: 2.06 mm

External dimensions/height: 8.25 mm

External dimensions/packaging: eSIP-16K

Physical parameters/operating temperature: -40℃ ~ 150℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Other/Manufacturing Applications: General

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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