Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA300-FG144
|
SOC | 类似代替 | LBGA-144 |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA144, 1MM PITCH, FBGA-144
|
||
APA300-FG144
|
Microsemi | 类似代替 | LBGA-144 |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA144, 1MM PITCH, FBGA-144
|
||
|
|
Actel | 功能相似 | LBGA |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA144, 1MM PITCH, FBGA-144
|
||
APA300-FG144I
|
Microsemi | 功能相似 | FBGA-144 |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA144, 1MM PITCH, FBGA-144
|
||
APA300-FG144M
|
Microchip | 完全替代 | FBGA |
FPGA ProASICPLUS Family 300K Gates 180MHz 0.22um Technology 2.5V 144Pin FBGA
|
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