Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
APA300-FG256I
|
Microsemi | 功能相似 | FBGA-256 |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA256, 1MM PITCH, FBGA-256
|
||
APA300-FGG256
|
SOC | 功能相似 | LBGA-256 |
FPGA - 现场可编程门阵列 ProASIC Plus
|
||
APA300-FGG256I
|
SOC | 功能相似 | LBGA-256 |
Field Programmable Gate Array, 300000Gates, 180MHz, 8192-Cell, CMOS, PBGA256, 1MM PITCH, ROHS COMPLIANT, FBGA-256
|
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