Encapsulation parameters/Encapsulation: BBGA-256
External dimensions/packaging: BBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Motorola | 功能相似 | 256 |
NXP MPC870CVR133 芯片, 微控制器, 32位, POWER, 133MHZ, BGA-256
|
||
MPC870CVR133
|
Freescale | 功能相似 | BGA-256 |
NXP MPC870CVR133 芯片, 微控制器, 32位, POWER, 133MHZ, BGA-256
|
||
MPC870CVR133
|
NXP | 功能相似 | BGA-256 |
NXP MPC870CVR133 芯片, 微控制器, 32位, POWER, 133MHZ, BGA-256
|
||
MPC870CVR133
|
Freescale | 功能相似 | BGA-256 |
NXP MPC870CVR133 芯片, 微控制器, 32位, POWER, 133MHZ, BGA-256
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review