Technical parameters/power supply voltage (DC): 5.50V (max)
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 3 mm
External dimensions/width: 3 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM89-1CIMM/NOPB
|
National Semiconductor | 类似代替 | MSOP |
具有 SMBus 接口和 2 个地址用于总线共享的 ±0.75°C 远程和本地温度传感器 8-VSSOP 0 to 125
|
||
LM89-1CIMM/NOPB
|
TI | 类似代替 | VSSOP-8 |
具有 SMBus 接口和 2 个地址用于总线共享的 ±0.75°C 远程和本地温度传感器 8-VSSOP 0 to 125
|
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