Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: C-MELF
External dimensions/packaging: C-MELF
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
JANTX1N6171AUS
|
Microsemi | 功能相似 | G-MELF |
Diode TVS Single Bi-Dir 121.6V 1.5kW 2Pin G-MELF
|
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