Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 3.3 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 1156
Encapsulation parameters/Encapsulation: FCBGA-1156
External dimensions/length: 35 mm
External dimensions/width: 35 mm
External dimensions/height: 2.82 mm
External dimensions/packaging: FCBGA-1156
External dimensions/thickness: 2.82 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Other/Manufacturing Applications: switch interface
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
89H64H16AG2ZCBL
|
Integrated Device Technology | 完全替代 | BBGA-1156 |
PCI接口IC PCIE GEN2 SWITCH
|
||
89H64H16AG2ZCBL
|
Renesas Electronics | 完全替代 |
PCI接口IC PCIE GEN2 SWITCH
|
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