Technical parameters/rated power: 500 W
Technical parameters/breakdown voltage: 6.5 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMT
External dimensions/packaging: SMT
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
1N6462US
|
Microsemi | 类似代替 | E-MELF |
t Dap Uni 500W 6V
|
||
|
|
Semtech Corporation | 类似代替 | Axial |
Diode TVS Single Uni-Dir 6V 500W 2Pin Case E
|
||
|
|
Semtech Corporation | 类似代替 | SMD |
ESD Suppressors / TVS Diodes T DAP UNI 500W 6V SM
|
||
JANTXV1N6462US
|
Microchip | 类似代替 | SQ-MELF-2 |
ESD Suppressors / TVS Diodes T DAP UNI 500W 6V SM
|
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