Package parameters/number of pins: 956
Encapsulation parameters/Encapsulation: BGA
External dimensions/packaging: BGA
Other/Counting: Surface Mount
Other/Fabric Technology: 45 nm
Other/Maximum Speed: 1600 MHz
Other/Pin Count: 956
Other/Device Core: SU9600
Other/Data Bus Width: 64 Bit
Other/Operating Supply Voltage: 1.05 to 1.15 V
Other/I/O Voltage: 1.05 V
Other/Number of CPU Cores: 2
Other/Supplier Package: BGA
Other/Product Dimensions: 22 x 22
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review