Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC374APW,112
|
NXP | 完全替代 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin TSSOP Bulk
|
||
|
|
NXP | 完全替代 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1Element 20Pin TSSOP T/R
|
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