Technical parameters/digits: 8
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 6.6 mm
External dimensions/width: 4.5 mm
External dimensions/height: 0.95 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC573PW,118
|
Nexperia | 类似代替 | TSSOP-20 |
NXP 74HC573PW,118 芯片, D型锁存器, 透明, 八路, TSSOP-20
|
||
74HC573PW,118
|
NXP | 类似代替 | TSSOP-20 |
NXP 74HC573PW,118 芯片, D型锁存器, 透明, 八路, TSSOP-20
|
||
MC74HC573ADTG
|
ON Semiconductor | 功能相似 | TSSOP-20 |
ON SEMICONDUCTOR MC74HC573ADTG 芯片, 74HC CMOS逻辑器件
|
||
MC74HC573ADTG
|
ON Semiconductor | 功能相似 | TSSOP-20 |
ON SEMICONDUCTOR MC74HC573ADTG 芯片, 74HC CMOS逻辑器件
|
||
SN74HC573APWR
|
TI | 功能相似 | TSSOP-20 |
TEXAS INSTRUMENTS SN74HC573APWR 芯片, 八D型锁存器
|
||
SN74HC573APWR
|
TI | 功能相似 | TSSOP-20 |
TEXAS INSTRUMENTS SN74HC573APWR 芯片, 八D型锁存器
|
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