Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 250 mW
Technical parameters/power supply voltage: 2V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: XFDFN-6
External dimensions/packaging: XFDFN-6
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74AHC1G126GM
|
NXP | 完全替代 | XSON-6 |
总线缓冲器/线路驱动器;三态 Bus buffer/line driver; 3-state
|
||
74AHC1G126GM
|
Rochester | 完全替代 |
总线缓冲器/线路驱动器;三态 Bus buffer/line driver; 3-state
|
|||
74AHC1G126GM,132
|
Nexperia | 完全替代 | XFDFN-6 |
Buffer/Line Driver 1CH Non-Inverting 3-ST CMOS 6Pin XSON T/R
|
||
74AHCT1G126GM,132
|
NXP | 类似代替 | XFDFN-6 |
Buffer/Line Driver 1CH Non-Inverting 3-ST CMOS 6Pin XSON T/R
|
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