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Description AAVID THERMALLOY 374324B00035G Heat sink, square, circuit board, for ball grid array, BGA, 30.6 ° C/W, 10 mm, 27 mm, 27 mm
Product QR code
Packaging BGA
Delivery time
Packaging method Tray
Standard packaging quantity 1
28.31  yuan 28.31yuan
5+:
$ 33.1227
50+:
$ 31.7072
200+:
$ 30.9145
500+:
$ 30.7164
1000+:
$ 30.5182
2500+:
$ 30.2917
5000+:
$ 30.1502
7500+:
$ 30.0086
Quantity
5+
50+
200+
500+
1000+
Price
$33.1227
$31.7072
$30.9145
$30.7164
$30.5182
Price $ 33.1227 $ 31.7072 $ 30.9145 $ 30.7164 $ 30.5182
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(4408) Minimum order quantity(5)
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Technical parameters/thermal resistance: 30.6 ℃/W

Encapsulation parameters/installation method: Surface Mount

Encapsulation parameters/Encapsulation: BGA

External dimensions/length: 27 mm

External dimensions/width: 27 mm

External dimensions/height: 10 mm

External dimensions/packaging: BGA

Physical parameters/color: Black

Physical parameters/materials: Aluminum

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

Compliant with standards/REACH SVHC standards: No SVHC

Compliant with standard/REACH SVHC version: 2015/12/17

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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FISCHER ELEKTRONIK ICK BGA 27X27 散热器, 用于球栅阵列, BGA, 20 °C/W, 6 mm, 27 mm, 27 mm
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