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Description 3.3CMOS Dual Asynchronous FIFO DUAL 512 × 9, Dual 1024 × 9, Dual 2048 × 9, Dual 4096 × 9 DUAL 8192 × 9 3.3 Volt CMOS DUAL ASYNCHRONOUS FIFO DUAL 512 x 9, DUAL 1,024 x 9 DUAL 2,048 x 9, DUAL 4,096 X 9 DUAL 8,192 X 9
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Packaging TSSOP-56
Delivery time
Packaging method Tray
Standard packaging quantity 1
67.74  yuan 67.74yuan
1+:
$ 77.9056
10+:
$ 74.5184
100+:
$ 73.9087
250+:
$ 73.4345
500+:
$ 72.6893
1000+:
$ 72.3506
2500+:
$ 71.8764
5000+:
$ 71.4699
Quantity
1+
10+
100+
250+
500+
Price
$77.9056
$74.5184
$73.9087
$73.4345
$72.6893
Price $ 77.9056 $ 74.5184 $ 73.9087 $ 73.4345 $ 72.6893
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(5623) Minimum order quantity(1)
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Technical parameters/number of circuits: 2

Technical parameters/access time: 15 ns

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/power supply voltage: 3V ~ 3.6V

Technical parameters/power supply voltage (Max): 3.6 V

Technical parameters/power supply voltage (Min): 3 V

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 56

Encapsulation parameters/Encapsulation: TSSOP-56

External dimensions/length: 14.0 mm

External dimensions/width: 6.10 mm

External dimensions/packaging: TSSOP-56

External dimensions/thickness: 1.00 mm

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tray

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
72V81L20PA 72V81L20PA Integrated Device Technology 类似代替 TSSOP-56
先进先出 3.3V VER. OF 7281S
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