Technical parameters/access time: 6.5 ns
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: LQFP-64
External dimensions/length: 14 mm
External dimensions/width: 14 mm
External dimensions/packaging: LQFP-64
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V295L10PF
|
Integrated Device Technology | 完全替代 | TQFP-64 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 18 64Pin TQFP
|
||
72V295L10PF8
|
Integrated Device Technology | 完全替代 | LQFP-64 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 128K x 18 64Pin TQFP T/R
|
||
72V295L10PFG
|
Integrated Device Technology | 完全替代 | TQFP-64 |
先进先出 3.3V 4M SUPER SYNC II
|
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