Technical parameters/access time: 5 ns
Technical parameters/power supply voltage: 3.15V ~ 3.45V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 80
Encapsulation parameters/Encapsulation: LQFP-80
External dimensions/length: 14.0 mm
External dimensions/width: 14.0 mm
External dimensions/packaging: LQFP-80
External dimensions/thickness: 1.40 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72V233L6PF8
|
Integrated Device Technology | 类似代替 | LQFP-80 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18/2K x 9 80Pin TQFP T/R
|
||
SN74ACT7802-60PN
|
TI | 功能相似 | LQFP-80 |
1024 】 18选通,先入先出存储器 1024 】 18 STROBED FIRST-IN, FIRST-OUT MEMORY
|
||
SN74ACT7881-20PN
|
TI | 功能相似 | LQFP-80 |
FIFO Mem Sync Dual Depth/Width Uni-Dir 1K x 18 80Pin LQFP
|
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