Technical parameters/power supply current: 60 mA
Technical parameters/access time: 10ns,3.6ns
Technical parameters/power supply voltage: 2.375V ~ 2.625V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: BGA-144
External dimensions/packaging: BGA-144
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
72T1895L5BB
|
Integrated Device Technology | 类似代替 | BGA-144 |
FIFO 2.5V 32K X 18/ 64K X 9 FIF
|
||
72T1895L5BBI
|
Integrated Device Technology | 类似代替 | BGA-144 |
FIFO 2.5V 32K X 18/ 64K X 9 FIF
|
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