Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TQFP
External dimensions/packaging: TQFP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
70V07L25PFG8
|
Integrated Device Technology | 功能相似 | TQFP-80 |
Ic Sram 256Kbit 25ns 80tqfp
|
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