Technical parameters/number of circuits: 1
Technical parameters/maximum duty cycle: 3 %
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: VFQFN-20
External dimensions/length: 4 mm
External dimensions/width: 4 mm
External dimensions/height: 1 mm
External dimensions/packaging: VFQFN-20
External dimensions/thickness: 1.00 mm
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
9DBL411BGILFT
|
Renesas Electronics | 完全替代 | TSSOP-20 |
四个输出低功耗差动扇出缓冲器用于PCI Express第一代,第二代,以及QPI Four Output Low Power Differential Fanout Buffer for PCI Express Gen1, Gen2, and QPI
|
||
9DBL411BKILF
|
Integrated Device Technology | 完全替代 | VFQFPN-20 |
四个输出低功耗差动扇出缓冲器用于PCI Express第一代,第二代,以及QPI Four Output Low Power Differential Fanout Buffer for PCI Express Gen1, Gen2, and QPI
|
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