Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-28
External dimensions/packaging: DIP-28
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: 3A991
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
IDT71256SA15TP
|
Integrated Device Technology | 功能相似 | DIP-28 |
CMOS静态RAM 256K ( 32K ×8位) CMOS STATIC RAM 256K (32K x 8-BIT)
|
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