Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-8
External dimensions/packaging: TSSOP-8
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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|
Integrated Device Technology | 功能相似 | TSSOP-8 |
Clock Fanout Buffer 4Out 8Pin TSSOP Tube
|
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Integrated Device Technology | 功能相似 | TSSOP-8 |
IC CLK BUFFER 1:4 140MHz 8TSSOP
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