Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Renesas Electronics | 功能相似 | TSSOP-16 |
时钟驱动器及分配 PECL/CMOS TO CMOS CLOCK DRIVER
|
||
ICS558G-01T
|
Integrated Device Technology | 功能相似 | TSSOP-16 |
IC CLK BUFFER 2:4 250MHz 16TSSOP
|
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