Technical parameters/power supply voltage: 1.14V ~ 1.26V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: XFBGA-25
External dimensions/packaging: XFBGA-25
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Discontinued at Digi-Key
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ICE40LM4K-SWG25TR
|
Lattice Semiconductor | 完全替代 | XFBGA-25 |
FPGA - 现场可编程门阵列 3520 LUTs 80K RAM 1.2V
|
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