Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 54
Encapsulation parameters/Encapsulation: TSOP-2
External dimensions/length: 22.22 mm
External dimensions/width: 10.16 mm
External dimensions/packaging: TSOP-2
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
W9864G6IH-5
|
Winbond Electronics | 功能相似 | TSOP-2 |
DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54Pin TSOP-II
|
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