Technical parameters/number of contacts: 8
Technical parameters/number of pins: 8
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
Packaging parameters/pin spacing: 2.54 mm
External dimensions/width: 20.3 mm
External dimensions/height: 10.2 mm
External dimensions/packaging: TSSOP
External dimensions/pin spacing: 2.54 mm
External dimensions/thickness: 787 µm
Physical parameters/contact material: Copper
Physical parameters/materials: Epoxy Glass
Other/Product Lifecycle: Active
Other/Manufacturing Applications: Industrial, industry
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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