Technical parameters/dissipated power (Max): 150000 mW
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TO-3
External dimensions/packaging: TO-3
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Microsemi | 完全替代 | TO-3 |
Trans Pnp 300V 8A To-3
|
||
2N6671
|
ETC | 完全替代 |
Trans Pnp 300V 8A To-3
|
|||
2N6671
|
Microchip | 完全替代 |
Trans Pnp 300V 8A To-3
|
|||
2N6671
|
Central Semiconductor | 完全替代 | TO-204 |
Trans Pnp 300V 8A To-3
|
||
2N6673
|
Microchip | 完全替代 |
Trans GP BJT NPN 400V 8A 3Pin(2+Tab) TO-3
|
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