Technical parameters/number of rows: 2
Technical parameters/number of pins: 28
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 35.6 mm
External dimensions/height: 1.58 mm
External dimensions/packaging: SOIC
Physical parameters/contact material: Brass Alloy
Physical parameters/operating temperature: -55℃ ~ 105℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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