Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADG506ABQ
|
ADI | 功能相似 | CDIP-28 |
CMOS 8位/ 16通道模拟多路复用器 CMOS 8-/16-Channel Analog Multiplexers
|
||
ADG506ATQ
|
ADI | 功能相似 | CDIP-28 |
CMOS 8位/ 16通道模拟多路复用器 CMOS 8-/16-Channel Analog Multiplexers
|
||
HI3-0506A-5Z
|
Renesas Electronics | 功能相似 | PDIP-28 |
INTERSIL HI3-0506A-5Z 芯片, 多路复用器, CMOS
|
||
HI3-0506A-5Z
|
Intersil | 功能相似 | DIP-28 |
INTERSIL HI3-0506A-5Z 芯片, 多路复用器, CMOS
|
||
|
|
Harris | 功能相似 |
INTERSIL HI3-0506A-5Z 芯片, 多路复用器, CMOS
|
|||
MPC506AP
|
TI | 功能相似 | PDIP-28 |
TEXAS INSTRUMENTS MPC506AP.. 芯片, 多路复用器, 16路, DIP28
|
||
MPC506AP
|
Burr Brown | 功能相似 | DIP |
TEXAS INSTRUMENTS MPC506AP.. 芯片, 多路复用器, 16路, DIP28
|
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