Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HE722A0500
|
Z-TEK | 类似代替 |
HE700 系列 双列直插 0.5 A 双刀单掷-常开 5 VDC PCB 安装 簧片继电器
|
|||
HE722A0500
|
Littelfuse | 类似代替 | DIP |
HE700 系列 双列直插 0.5 A 双刀单掷-常开 5 VDC PCB 安装 簧片继电器
|
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