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Description GBPC15 Series 15 A 1000 V quick connect single-phase bridge rectifier
Product QR code
Brand: VISHAY
Packaging GBPC
Delivery time
Packaging method Bulk
Standard packaging quantity 1
31.56  yuan 31.56yuan
1+:
$ 38.5044
10+:
$ 36.2952
100+:
$ 34.6540
250+:
$ 34.4015
500+:
$ 34.1490
1000+:
$ 33.8650
2500+:
$ 33.6125
5000+:
$ 33.4547
Quantity
1+
10+
100+
250+
500+
Price
$38.5044
$36.2952
$34.6540
$34.4015
$34.1490
Price $ 38.5044 $ 36.2952 $ 34.6540 $ 34.4015 $ 34.1490
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2452) Minimum order quantity(1)
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Technical parameters/number of pins: 4

Technical parameters/forward voltage: 1.1 V

Technical parameters/forward current: 15 A

Technical parameters/Maximum forward surge current (Ifsm): 300 A

Technical parameters/forward voltage (Max): 1.1 V

Technical parameters/forward current (Max): 15 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -55 ℃

Encapsulation parameters/installation method: Screw

Package parameters/number of pins: 4

Encapsulation parameters/Encapsulation: GBPC

External dimensions/length: 28.8 mm

External dimensions/width: 28.8 mm

External dimensions/height: 7.62 mm

External dimensions/packaging: GBPC

Other/Product Lifecycle: Active

Other/Packaging Methods: Bulk

Compliant with standards/RoHS standards:

Compliant with standards/lead standards: Lead Free

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Alternative material

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GBPC1510-E4 GBPC1510-E4 VISHAY 完全替代 GBPC
GBPC15 系列,Vishay Semiconductor 高电流 15A 通用,3 路接线端子:推进式,环绕或焊接 玻璃钝化芯片接线 低热阻 ### 认可 UL E54214 ### 桥式整流器 - Vishay Semiconductor 桥式整流器将交流 (AC) 输入转换为直流 (DC) 输出,用于全波整流应用。 二极管排列为任一输入极性提供相同的输出极性。 三相全波整流器是桥式电路配置中的六个二极管的排列。 封装设计用于提供最小尺寸、最高可靠性和最大热性能。
GBPC1510-E4 GBPC1510-E4 Vishay Semiconductor 完全替代
GBPC15 系列,Vishay Semiconductor 高电流 15A 通用,3 路接线端子:推进式,环绕或焊接 玻璃钝化芯片接线 低热阻 ### 认可 UL E54214 ### 桥式整流器 - Vishay Semiconductor 桥式整流器将交流 (AC) 输入转换为直流 (DC) 输出,用于全波整流应用。 二极管排列为任一输入极性提供相同的输出极性。 三相全波整流器是桥式电路配置中的六个二极管的排列。 封装设计用于提供最小尺寸、最高可靠性和最大热性能。
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