Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LBGA-100
External dimensions/packaging: LBGA-100
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Not Recommended
Compliant with standards/RoHS standards:
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Intel | 完全替代 | FBGA-100 |
可编程逻辑器件(CPLD/FPGA) EPM7128AEFC100-10 BGA-100
|
||
EPM7128AEFC100-5
|
Intel | 完全替代 | FBGA-100 |
CPLD MAX 7000A Family 2.5K Gates 128 Macro Cells 192.3MHz 3.3V 100Pin FBGA
|
||
EPM7128AEFC100-7
|
Altera | 完全替代 | FBGA-100 |
CPLD MAX 7000A Family 2.5K Gates 128 Macro Cells 129.9MHz 3.3V 100Pin FBGA
|
||
|
|
Intel | 完全替代 | LBGA-100 |
CPLD MAX 7000A Family 2.5K Gates 128 Macro Cells 129.9MHz 3.3V 100Pin FBGA
|
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